# Ace nanochem Develops Three New Semiconductor Materials for Power Devices and Advanced Packaging

- Link: https://www.thailand-business-news.com/pr-news/ace-nanochem-develops-three-new-semiconductor-materials-for-power-devices-and-advanced-packaging
- Published: 2026-11-02T07:00:00+07:00
- Author: PR Newswire

_New Poly-Si slurry, silicon bare wafer surface treatment solution, and glass TGV
slurry support next-generation semiconductor manufacturing as the company expands
its engagement in Taiwan and Japan._

SEOUL, South Korea, Nov. 2, 2026 /PRNewswire/ — Ace nanochem Co., Ltd., a South 
Korean semiconductor materials company led by CEO Jonghoon Lee, has completed development
of three materials solutions for semiconductor manufacturing: Poly-Si slurry for
power trench MOSFETs, a surface treatment solution for silicon bare wafers after
chemical mechanical polishing (CMP), and slurry for glass through-glass via (TGV)
processing. The company plans to build on these developments to expand its engagement
with semiconductor manufacturers in Taiwan and Japan.

 [⌊Ace nanochem Co., Ltd. has over 20 years of specialized expertise in colloidal silica (SiO_2) nanoparticle control technology.⌉](https://mmx.prnasia.com/media/MS2016930/20261020045013EDT_image_1.jpg?id=OA3028856&p=medium600)

Ace nanochem Co., Ltd. has over 20 years of specialized expertise in colloidal silica(
SiO_2) nanoparticle control technology.

The three solutions address different challenges in semiconductor manufacturing,
from selective polishing in power devices to surface cleanliness and planarity in
advanced packaging.

Ace nanochem’s Poly-Si Slurry for Power Trench MOSFETs is designed to provide high
removal rates for polysilicon while minimizing damage to the gate oxide. The formulation
aims to improve polishing performance while reducing scratches, particle generation,
dishing, and erosion, helping support process control and wafer surface quality.

The Silicon Bare Wafer Surface Treatment Solution is applied after CMP to improve
wafer surface wettability and help prevent contamination. By reducing particle adhesion
following polishing, the solution is designed to support the stringent surface cleanliness
requirements of subsequent manufacturing processes.

For advanced semiconductor packaging, Ace nanochem’s Slurry for Glass TGV is designed
to polish materials with different physical properties, including copper bulk, barrier
metal, and bare glass. Its ability to process these materials together is intended
to support the planarity and surface uniformity required for TGV manufacturing.

Building on its experience supplying semiconductor materials to major manufacturers
in South Korea, Ace nanochem is working to develop further business opportunities
in Taiwan and Japan, both important markets in the global semiconductor industry.
The company participates regularly in SEMICON TAIWAN and pursues technical collaboration
with leading foundries to strengthen relationships with overseas customers and industry
partners.

"These three products reflect our focus on developing semiconductor materials for
demanding manufacturing processes, from power devices to advanced packaging," said
Jonghoon Lee, CEO of Ace nanochem. "We aim to build on our materials technology 
and manufacturing capabilities to deepen technical collaboration with semiconductor
manufacturers in Taiwan, Japan, and other global markets."

**About Ace nanochem Co., Ltd.**

Since launching its colloidal silica business in December 1999, Ace nanochem Co.,
Ltd. has accumulated more than 20 years of specialized expertise in colloidal silica(
_SiO_(2)_) nanoparticle control technology.

The company operates fully automated manufacturing lines and a dedicated raw material
production facility with a stated annual capacity of 60,000 tons. Ace nanochem supplies
its ACESOL® semiconductor CMP slurries and ACESOL®WP wafer polishing slurries to
major semiconductor and wafer manufacturers, including SK hynix, SK siltron, SSMC,
GlobalWafers, and Amkor Technology.

The company has received the South Korean government’s $10 Million Export Tower 
award and Best Partner Awards from SK hynix, SK siltron, and SSMC.

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