# DECO Showcases Ultra-Compact 65W Fast-Charging Solution at Asia Charging Expo 2026

- Link: https://www.thailand-business-news.com/pr-news/deco-showcases-ultra-compact-65w-fast-charging-solution-at-asia-charging-expo-2026
- Published: 2026-09-14T10:39:00+07:00
- Author: MarketersMEDIA Newswire

Shenzhen, Guangdong Province, China, September 14, 2026 — DECO Integration Technology
Co., Ltd. (“DECO”), a semiconductor company specializing in ultra-short-range mmWave
connectivity chip design, showcased its mmWave high-frequency SiP power ICs and 
related solutions at the 2026 Autumn Asia Charging Expo (ACE 2026), including an
ultra-compact 65W fast-charging solution built on the DKP36xx series of chips and
modules. Combining high-frequency operation, wide-bandgap (WBG) semiconductors, 
and SiP integration, the solution increases power density while addressing dynamic
response, safety isolation, and scalable automated production.

![](https://storage.googleapis.com/mmstudio-images/gallery/QMDU0YjNqlfOqfBZnztCFUnAgIL2/
89203092-1789357183-1.jpg)

The significance of the solution goes beyond making a smaller 65W charger. As the
fast-charging industry moves beyond power upgrades toward a greater focus on system
efficiency and space utilization, advances in power devices alone are no longer 
sufficient to fully realize the performance potential of WBG semiconductors such
as GaN and SiC. Control, isolation, gate drive, and overall system architecture 
must evolve together, while power-supply design is increasingly moving toward higher-
frequency operation, greater integration, and system-level co-design. By deeply 
integrating mmWave wireless isolation technology with advanced power-control architecture,
DECO provides a new architectural option for high-power-density power supplies.

![](https://storage.googleapis.com/mmstudio-images/gallery/QMDU0YjNqlfOqfBZnztCFUnAgIL2/
89203092-1789357183-2.jpg)

Based on this solution, the 65W fast charger can be implemented in two compact form
factors: the “Biscuit” form factor, with PCBA dimensions of 62.5 × 37.5 × 12 mm,
and the “Cubelet” form factor, with PCBA dimensions of 36 × 27.5 × 26 mm. The solution
supports high-frequency operation at 100 kHz, 300 kHz, 500 kHz, and 1 MHz. Higher
switching frequencies help reduce the size of magnetic components, capacitors, and
the overall power supply, bringing the system volume down to approximately one-quarter
to one-third of that of conventional solutions and significantly increasing power
density.

At the system level, the solution adopts a Secondary Master Control Architecture,
in which the secondary side controls the primary side. This architecture features
low loop-signal latency and fast dynamic response, helping minimize output-voltage
fluctuations and accelerate recovery during load transients. For primary-side control,
secondary-side control, isolation, and GaN gate-drive functions, DECO offers both
discrete-chip and SiP solutions. The DKP3680 SiP Power IC integrates all four functions
into a single chip, consolidating functions traditionally implemented by four discrete
ICs. This helps simplify peripheral circuitry while reducing power-supply design
complexity and overall system cost.

The solution is built on DECO’s proprietary MillConnex® mmWave wireless isolation
technology, which enables low-latency isolated communication in high-frequency and
high-voltage environments and meets the control requirements of fast-switching power-
supply systems.

The 65W fast-charging solution represents a practical implementation of DECO’s integration
of mmWave wireless isolation technology with power-control architecture. Beyond 
opening a new path toward further miniaturization of end-user charging devices, 
it also demonstrates the value of high-frequency architectures and chip-level integration
in increasing power density, reducing peripheral components, and improving manufacturing
consistency.

As power systems continue to evolve toward higher switching frequencies and greater
integration, DECO will further advance the co-development of mmWave wireless isolation
technology with GaN and SiC power devices and system architectures, accelerating
validation and adoption across applications including fast charging, AI data centers
and computing power supplies, new-energy and industrial power systems, and high-
voltage automotive power electronics.

For more information, sample requests, or technical inquiries, please contact:
**
[sales@decosemi.com](https://www.thailand-business-news.com/pr-news/sales@decosemi.com)**

Contact Info: 
Name: Hovi HeEmail: [Send Email](https://send.releasecontact.com/89203092)
Organization: DECO Integration Technology Co., LtdWebsite: [https://decosemi.com/en/contact-us/](https://decosemi.com/en/contact-us/)

Release ID: 89203092

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**Source** : [DECO Showcases Ultra-Compact 65W Fast-Charging Solution at Asia Charging Expo 2026](https://news.marketersmedia.com/deco-showcases-ultra-compact-65w-fast-charging-solution-at-asia-charging-expo-2026/89203092?rand=206000)

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