# E&R Engineering Spotlights High-Precision CPO and Advanced Packaging Solutions at SEMI West 2026

- Link: https://www.thailand-business-news.com/pr-news/er-engineering-spotlights-high-precision-cpo-and-advanced-packaging-solutions-at-semi-west-2026
- Published: 2026-10-06T21:00:00+07:00
- Author: PR Newswire

KAOHSIUNG, Oct. 6, 2026 /PRNewswire/ — E&R Engineering Corp. (TPEX: 8027), a specialist
in semiconductor laser and plasma processing equipment, will highlight its latest
semiconductor laser processing breakthroughs at SEMI West 2026, focusing on high-
precision laser drilling for Fiber Array Units (FAUs) and advanced packaging solutions.

**Five-Axis FAU Laser Drilling with ±0.5 μm Accuracy**

To meet growing demand for high-density optical components in high-speed optical
communications and Co-Packaged Optics (CPO), E&R has developed a high-precision 
FAU laser processing solution. Development is focused on 2D FAU configurations supporting
bandwidths of 3.2 Tbps, 6.4 Tbps, and 12.8 Tbps. Combining five-axis laser control,
precision positioning, and micromachining, the solution achieves drilling accuracy
of ±0.5 μm and supports various hole geometries and processing angles.

**Comprehensive Laser & Plasma Solutions for Next-Gen AI & HPC Packaging**

To address the stringent interconnect density and thermal budget challenges driven
by AI and HPC architectures, E&R delivers an end-to-end processing portfolio for
advanced 2.5D/3D ICs and high-density substrates. E&R’s capabilities include high-
precision laser drilling (achieving ±5 μm accuracy with a blind via B/T ratio up
to 90%), high-throughput multi-beam laser marking (±25 μm accuracy), controlled 
thermal laser cutting, and lane-defined ABF grooving. By seamlessly integrating 
laser debonding into packaging workflows alongside high-stability plasma systems(
CPK > 1.33) for surface cleaning and activation, E&R’s process integration platform
supports customers across the entire continuum—from initial R&D validation through
full production-scale deployment.

**Robust U.S. Service & Technical Support**

Backed by local service teams across key U.S. hubs—including Portland, Arizona, 
and Texas—E&R ensures rapid response times, remote diagnostics, and tailored technical
support. This regional presence minimizes downtime, optimizes yield, and accelerates
time-to-market for North American semiconductor partners.

**E&R at SEMI West 2026**

 ◦ **Dates:** October 13 – October 15, 2026
 ◦ **Venue:** Moscone Center, San Francisco, California, USA
 ◦ **Booth:** South Hall, Hall C, #2153
 ◦ **Website:**[https://en.enr.com.tw/](https://en.enr.com.tw/)

[⌊E&R Unveils Precision Laser Micromachining Platform for 2D FAU Arrays at SEMI 
West 2026⌉⌊E&R Unveils Precision Laser Micromachining Platform for 2D FAU Arrays
at SEMI West 2026⌉[
E&R Unveils Precision Laser Micromachining Platform for 2D FAU
Arrays at SEMI West 2026

 

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