# FIT Tech Day 2026 Focuses on Optical Connectivity in the AI Era, Bringing Global Industry Leaders Together to Explore "Light at Scale"

- Link: https://www.thailand-business-news.com/pr-news/fit-tech-day-2026-focuses-on-optical-connectivity-in-the-ai-era-bringing-global-industry-leaders-together-to-explore-light-at-scale
- Published: 2026-09-16T10:00:00+07:00
- Author: PR Newswire

HONG KONG, Sept. 16, 2026 /PRNewswire/ — Foxconn Interconnect Technology (FIT Hon
Teng, HKEX: 6088) today hosted FIT Tech Day 2026, themed "Light at Scale: The Next
Frontier in Data Center Interconnects." The event brought together global leaders
from the optical communications, AI, and semiconductor industries to explore the
next generation of connectivity for AI, spanning light sources, materials, photonics,
network architectures, manufacturing, and the broader industry ecosystem.

The event also showcased the cross-disciplinary integration capabilities of the 
Hon Hai Technology Group. Young Liu, Chairman of Hon Hai Technology Group, attended
the event, while Brand Cheng, Chairman of FII, delivered the opening remarks. Together,
they highlighted the Group’s comprehensive capabilities spanning semiconductors,
AI, cloud infrastructure, and advanced manufacturing.

"AI is redefining data center architectures while simultaneously driving optical
communications into a new phase of development. Over the next decade, we expect 
to see not only faster optical technologies, but also how optical connectivity can
be deployed more reliably and efficiently at scale," said Sidney Lu, Chairman of
FIT. "By integrating the diverse businesses and technological capabilities across
the Hon Hai Technology Group, we have an opportunity to advance innovation in optical
communications beyond individual components toward more integrated systems and large-
scale applications."

The first half of the event featured four keynote sessions exploring the next steps
for optical communications in the AI era from different layers of the technology
stack. Dr. Wupen Yuen of Lumentum examined the interconnect requirements driven 
by Scale-up, Scale-out, and Scale-across in AI system architectures, as well as 
the trend toward optics becoming a core element of AI system architecture. Dr. Chuck
Mattera reviewed the evolution of semiconductors, lasers, fiber optics, computing,
and manufacturing, and looked ahead to the evolution from Pluggable Optics, CPO,
and Optical I/O to Photonic Fabrics, supporting the transition of optical technologies
toward large-scale deployment. Mr. Yoshiaki Sato of NTT Innovative Devices focused
on the evolution of photonics-electronics convergence from an industry vision toward
practical implementation, and shared the detachable Optical Engine architecture 
based on socket technology co-developed with FIT. Mr. Ashkan Seyedi of ams OSRAM
introduced Wide & Slow Optics and Micro Emitter technologies, exploring how optics
moving closer to the compute core can address low latency, efficiency, density, 
reliability, and manufacturability.

The second half of the event featured a panel discussion moderated by Dr. Thomas
Liu of FIT, bringing together Dr. Hong Hou, CEO of Semtech; Dr. WP Huang, Chairman
of Ligent; Mr. Ernest Muhigana of MACOM; and Dr. Hao-Chung Kuo, Head of the Semiconductor
Research Center at Hon Hai Research Institute. The panel explored optical modules,
CPO, high-speed interconnects, and the broader ecosystem required by AI infrastructure,
discussing how innovations in optical communications can advance toward reliable
and scalable large-scale deployment as AI infrastructure continues to expand.

FIT Tech Day 2026 brings together leaders across the optical communications, AI,
semiconductor, and data center industries for in-depth cross-industry exchange. 
Through "Light at Scale," FIT and its global industry partners are exploring the
technologies, architectures, and collaborations shaping the next generation of connectivity.

**About Foxconn Interconnect Technology (FIT Hon Teng)**

Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange
in 2017 and is the largest consumer electronics connector manufacturer in Greater
China. While connectors remain its core business, the company has strategically 
expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic
components, while also entering the consumer brand sector. For more information,
please visit the company’s website at [www.fit-foxconn.com](http://www.fit-foxconn.com/)

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