# Lead Intelligent × OPPO: Enabling the "Crease-Free Folding" Breakthrough Through Chip-Level Precision Manufacturing

- Link: https://www.thailand-business-news.com/pr-news/lead-intelligent-x-oppo-enabling-the-crease-free-folding-breakthrough-through-chip-level-precision-manufacturing
- Published: 2026-06-05T13:08:00+07:00
- Author: PR Newswire

WUXI, China, June 5, 2026 /PRNewswire/ — In foldable smartphones, the ultimate competitive
frontier is no longer the display itself—but the microscopic support structures 
hidden beneath it. Recently, Wuxi Lead Intelligent Equipment Co., Ltd. (hereafter
referred to as Lead Intelligent) partnered with global device manufacturer OPPO 
to jointly advance a breakthrough manufacturing solution: the cross-industry introduction
of chip-level 3D printing technology into the production of foldable smartphone 
hinge structures.

This foundational innovation—one that moves beyond the limits of conventional mechanical
machining—has become a core enabling technology supporting the "crease-free folding"
experience targeted for the OPPO Find N6. At the same time, it opens new possibilities
for precision manufacturing across the global consumer-electronics industry.

**Crossing a Microscopic Manufacturing Threshold**

**When Conventional Machining Approaches Its Physical Limits**

In recent years, foldable smartphones have entered a phase of rapid global expansion.
Yet the visible screen crease remains one of the most persistent barriers to improving
user experience.

Why is the crease so difficult to eliminate? Within the extremely constrained structural
space of a foldable smartphone, even micron-level dimensional deviations that are
invisible to the naked eye can accumulate after thousands of folding cycles and 
ultimately manifest as visible surface deformation on the display.

Traditional machining and polishing processes are now approaching their physical
precision limits, making further step-change improvements in surface flatness increasingly
difficult to achieve.

To overcome this industry-wide microscopic constraint, Lead Intelligent and OPPO
moved beyond conventional process pathways by introducing a micron-scale additive
manufacturing solution—a technology typically reserved for semiconductor and chip
fabrication environments.

Using this approach, key hinge components can be reconstructed at the micron scale,
enabling the deposition of an ultra-uniform polymer support layer precisely matched
to the hinge surface geometry. This engineered micro-support structure provides 
controlled stress release during repeated folding cycles, creating the mechanical
foundation required for a genuinely crease-minimized folding experience and marking
an important step toward the next generation of foldable-device structural design.

**Industrial Synergy**

**Driving the Evolution of Advanced Manufacturing Through Foundational Innovation**

Lead Intelligent’s ability to precisely control the microscopic spreading behavior
of single-layer polymer materials across hinge substrates reflects long-term technological
accumulation in high-end equipment engineering and precision manufacturing. It also
represents the outcome of deep collaborative engagement with OPPO across product
architecture and structural-design development.

Together, the two companies overcame major technical barriers in ultra-high-precision
three-dimensional contour detection and hardware integration. Through thousands 
of rounds of joint optimization across critical process parameters, the partners
ultimately enabled this advanced manufacturing technology to achieve scalable validation
in real commercial production scenarios, marking a decisive transition from proof-
of-concept capability to industrial deployment.

By challenging conventional manufacturing boundaries and seeking solutions at the
microscopic scale, the collaboration between Lead Intelligent and OPPO represents
more than a targeted engineering upgrade addressing foldable-device hinge performance.
It signals a broader step forward in China’s capabilities in foundational materials
engineering and precision manufacturing technologies.

Looking ahead, Lead Intelligent will continue advancing into the most technically
demanding frontiers of advanced manufacturing, deepening collaboration with leading
partners across the industrial value chain and accelerating the transition of next-
generation laboratory-stage technologies into high-end industrial applications. 
Through these efforts, Lead Intelligent aims to provide a stronger technological
foundation supporting collaborative innovation across the global advanced-manufacturing
ecosystem.

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**Read the original article :** [Lead Intelligent × OPPO: Enabling the "Crease-Free Folding" Breakthrough Through Chip-Level Precision Manufacturing ](http://www.prnasia.com/story/archive/4976904_AE76904_0?rand=184833)