# LITEON Showcases NVIDIA 800 VDC Architecture and Thermal Management Portfolio at OCP Global Summit 2026

- Link: https://www.thailand-business-news.com/pr-news/liteon-showcases-nvidia-800-vdc-architecture-and-thermal-management-portfolio-at-ocp-global-summit-2026
- Published: 2026-10-14T23:00:00+07:00
- Author: PR Newswire

**Advancing Next-Generation Grid-to-Chip Energy Architecture for AI Infrastructure**

SAN JOSE, Calif., Oct. 15, 2026 /PRNewswire/ — LITEON Technology (2301) participates
in the Open Compute Project (OCP) Global Summit 2026 in San Jose, California, from
October 12 to 15, showcasing its next-generation AI factory infrastructure portfolio
centered on [800 VDC architecture](https://www.nvidia.com/en-us/data-center/technologies/800-vdc-architecture/).
The exhibition features power rack solutions supporting the [NVIDIA Vera Rubin platform](https://www.nvidia.com/en-us/data-center/technologies/rubin/),
integrated power and thermal management solutions designed for [NVIDIA MGX](https://www.nvidia.com/en-us/data-center/products/mgx/)
and OCP ORv3 architectures, demonstrating its Grid-to-Chip technology portfolio.

[⌊LITEON Showcases NVIDIA 800 VDC Architecture and Thermal Management Portfolio 
at OCP Global Summit 2026⌉⌊LITEON Showcases NVIDIA 800 VDC Architecture and Thermal
Management Portfolio at OCP Global Summit 2026⌉[
LITEON Showcases NVIDIA 800 VDC
Architecture and Thermal Management Portfolio at OCP Global Summit 2026

**800 VDC Advances Power and Cooling Architecture for Megawatt-Scale AI Infrastructure**

LITEON showcases its 800 VDC Power Shelf integrated with Battery Backup Unit (BBU),
demonstrating next-generation 800 VDC power architectures for AI factories. To address
the growing thermal demands of high-density AI computing, LITEON debuts the 2.6MW
Enterprise Cooling Distribution Unit (CDU) from its strategic investment partner,
DCX Liquid Cooling Systems. The solution delivers up to 2.6MW of heat transfer capacity,
achieves an approach temperature of 3°C, and incorporates an N+1 redundant pump 
design to maximize cooling efficiency while ensuring system reliability for high-
density AI and HPC deployments. Also on display is the CDU’s next-generation HMI
and integrated software layer, designed to enhance operational efficiency and provide
clear, at-a-glance visibility into key system parameters.

For the [NVIDIA Vera Rubin NVL72](https://www.nvidia.com/en-us/data-center/vera-rubin-nvl72/)
[ ](https://www.nvidia.com/en-us/data-center/vera-rubin-nvl72/)platform, LITEON 
is also showcasing an integrated infrastructure solution featuring a 95kW DC/DC 
Power Shelf and a 280kW Liquid-to-Liquid (L2L) In-Rack CDU. Designed based on NVIDIA
MGX architecture, the solution combines 800 VDC distribution, energy backup, and
thermal management technologies to reduce transmission losses and heat generation,
improve energy efficiency and power density, simplify power infrastructure, and 
free additional rack space for high-density AI deployments.

"In the AI era, data center competitiveness is no longer defined solely by compute
scale," said John Chang, General Manager of LITEON Cloud Infrastructure Platform
and Solution SBG. "Instead, it is measured by tokens per watt and how efficiently
power can be converted into meaningful AI output. As AI platforms continue to scale
in power density, data centers must simultaneously optimize energy efficiency, cooling
performance, and deployment flexibility. High-efficiency power delivery and thermal
management architecture have become the critical foundation for scaling future AI
Factories."

**ORv3 Power and Thermal Management Solutions Support Scalable AI Infrastructure**

LITEON is also showcasing an integrated AI power rack solution designed for the 
ORv3 architecture, integrating an 180kW Power Shelf and a 108kW Capacitor Backup
Unit (CBU). Through centralized power delivery and supercapacitor backup capabilities,
the solution addresses dynamic AI workloads while enhancing power stability and 
overall system reliability.

Optimized for liquid cooling compatibility, the ORv3 architecture enables higher-
density deployments and greater infrastructure flexibility. LITEON shows key cooling
modules including 120kW and 220kW In-Rack CDUs, which can be integrated with advanced
cooling technologies such as Direct-to-Chip architectures. These solutions enable
greater GPU density, enhanced thermal performance, and flexible infrastructure design
for next-generation AI and HPC platforms. By integrating power, backup, and thermal
management systems, LITEON helps customers build efficient, reliable, and scalable
AI infrastructure.

**From 800 VDC Distribution to GPU Power Delivery: Building a Complete Grid-to-Chip
Energy Architecture**

As AI processors continue to increase in power consumption, efficiently delivering
electricity from the rack level to the GPU has become a critical challenge for next-
generation AI infrastructure. To address this challenge, LITEON is showcasing its
comprehensive DC-DC power conversion portfolio, including 800V Power Bricks, IBC
Modules, 50V Power Bricks, and Voltage Regulator Modules (VRM). These product lines
bridge every stage of power delivery, from 800 VDC distribution and server-level
power conversion to chip-level voltage regulation, demonstrating LITEON’s complete
Grid-to-Chip energy architecture for future high-density AI computing platforms.

Among these, the 800V DC/DC power brick can be deployed on the HVDC power distribution
board (PDB) for downstream distribution and step-down conversion. Multiple bricks
can be paralleled to match different power requirements, with active current sharing
improving supply stability and reliability. The intermediate bus converter (IBC)
then performs the next stage of voltage conversion. This raises overall power delivery
efficiency, reduces distribution losses, optimises board area and system cost, and
improves supply stability in multi-output architectures. Finally, the voltage regulator
module (VRM) delivers a precise, stable operating voltage to the GPU, completing
the "last mile" of power delivery from the rack to the chip.

**Strengthening the Global Ecosystem to Enable Comprehensive AI Infrastructure Capabilities**

As AI computing infrastructure continues evolving toward higher power density and
greater energy efficiency, LITEON is expanding its capabilities across power delivery,
thermal management, and system-level energy optimization. By extending its expertise
from infrastructure power systems to comprehensive Grid-to-Chip energy management,
LITEON is building a complete portfolio of AI infrastructure energy solutions.

LITEON continues to deepen collaboration with NVIDIA and the broader OCP ecosystem
while leveraging its global manufacturing footprint and localized service capabilities.
Through close ecosystem partnerships, LITEON is helping customers address the growing
demand for high-performance, highly reliable, and highly scalable infrastructure
in the AI Factory era, accelerating deployment and expansion of next-generation 
AI data centers.

**LITEON Technology 2026 OCP Global Summit Exhibition Information:Date: October 
12–15, 2026
Venue: San Jose McEnery Convention Center, USABooth: C51, Hall 2

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