# NOVOSENSE Presents Semiconductor Technologies for xEV Powertrain and ADAS at Automotive Engineering Exposition 2026

- Link: https://www.thailand-business-news.com/pr-news/novosense-presents-semiconductor-technologies-for-xev-powertrain-and-adas-at-automotive-engineering-exposition-2026
- Published: 2026-05-27T17:30:00+07:00
- Author: PR Newswire

YOKOHAMA, Japan, May 27, 2026 /PRNewswire/ — NOVOSENSE (**688052.SH | 02676.HK**)
is exhibiting at **Automotive Engineering Exposition 2026**, held from **May 27 
to 29** at **PACIFICO Yokohama, Booth No. 206. **NOVOSENSE presents its automotive-
grade automotive semiconductor solutions for xEV powertrain, ADAS, body electronics
and lighting applications.

For **ADAS**, NOVOSENSE highlights video transmission and ultrasonic sensing technologies
for vehicle safety and auto-parking. Its **NLS911x serializer and NLS924x deserializer
automotive SerDes chipset**, based on the HSMT open protocol, supports links up 
to **6.4 Gbps** for low-latency transmission of multi-channel HD signals. The **
NSUC1800 ultrasonic sensor interface IC** is designed for **UPA, APA, AVP** and 
low-speed ADAS applications, combining DSI3 and AK2 compatibility with near-field
detection within **10 cm**, long-range detection up to **6–7 m**, and compliance
with **ISO 26262 ASIL B** and **AEC-Q100**. These technologies are also featured
in NOVOSENSE’s exhibitor seminar, **"ADAS Semiconductor Solutions Supporting Vehicle
Safety and Auto-Parking,"** on **May 27, 13:40–14:10, at Harbor Lounge A**.

For **xEV power systems**, NOVOSENSE focuses on isolation, gate driving and current
sensing for high-voltage power conversion. The **NSI6911F ASIL D isolated gate driver**
supports traction inverter, OBC and DC-DC applications with functional safety capability,
high CMTI performance, integrated 12-bit high-precision isolated ADC and diagnostic
protection. Together with **NSM2311, NSM2019, NSM2015 and NSM2012** current sensors,
the portfolio supports current feedback, system protection and efficient closed-
loop control.

For **body electronics and lighting**, NOVOSENSE presents products for ambient lighting,
rear lamps, thermal management, CAN FD communication and sensing. **NSUC1500-Q1 
and NSUC1527** support refined dimming, individual LED and multi-zone control, and
music-synchronized lighting effects. **NSL21912/16/24FS** linear LED drivers support
stable, precise and functionally safe rear lamp and body lighting control. **NSUC1602/
1610/1612 MCU+** products support thermal management actuator control, while **NCA1462-
Q1 and NCA1044-Q1** CAN FD transceivers, with **VeLIO certification** and European**
IBEE/FTZ-Zwickau EMC certification**, help improve in-vehicle network reliability
and reduce system verification effort.

NOVOSENSE works with **Yole Group** to host special insight sessions at its booth.**
Dr. Yu YANG**, Principal Lead Analyst – Automotives & Robotics, shares trends observed
at Beijing Auto 2026, including chassis and powertrain integration, L3 vs. L2/L4
convergence and 48V powernet. **Pierrick BOULAY**, Principal Analyst – Automotive
Semiconductors,  discusses Physical AI, ADAS, key semiconductors and the future 
of intelligent vehicles.

[[

NOVOSENSE’s automotive business continues to expand. In 2025, the company reported
approximately **US$495 million** in revenue, with automotive contributing over **
35%**. Annual automotive chip shipments exceeded **750 million**, bringing cumulative
shipments to more than **1.418 billion**. In Q1 2026, revenue reached approximately**
US$168 million**, up **59.17%** year on year.

The same product portfolio will also be showcased at **Automotive Engineering Exposition
NAGOYA 2026**, held from **June 17 to 19, Booth No. 176**.

**Learn more:** [www.novosns.com](http://www.novosns.com/en/)

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