# USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026

- Link: https://www.thailand-business-news.com/pr-news/usi-showcases-advanced-sic-chip-embedded-packaging-technology-at-pcim-europe-2026
- Published: 2026-05-27T06:00:00+07:00
- Author: PR Newswire

**~ Enabling Next-Generation Power Solutions ~**

SHANGHAI, May 27, 2026 /PRNewswire/ — USI, a global leader in electronic design 
and manufacturing services, today announced a breakthrough in advanced power semiconductor
packaging technology designed for next-generation power solutions. Leveraging its
innovative substrate and module integration capabilities, USI has successfully embedded
silicon carbide (SiC) dies into multilayer ABF substrates and adopted Single-Side
Copper Exposed (SSC) module packaging technology to integrate ceramic substrate 
insulation and wire-bondless architecture within industry-standard power packages.

 [ ⌊USI Power Module – Chip Embedded SiC Substrate⌉ ](https://mma.prnasia.com/media2/2987496/image1.html)

USI Power Module – Chip Embedded SiC Substrate

The innovative design marks a significant advancement in internally insulated power
discrete devices by enabling the package itself to deliver built-in electrical insulation
while simultaneously achieving low stray inductance and minimal conduction resistance.
Designed to address the growing industry demand for higher efficiency, superior 
thermal performance, and greater power density, USI’s chip-embedded module packaging
technology dramatically reduces conduction loss, lowers heat generation, and improves
long-term operational reliability compared with conventional packaging approaches.
By integrating a ceramic substrate, the package body provides reliable electrical
insulation without the need for additional isolation structures. Meanwhile, the 
wire-bondless architecture enables larger chip integration within a slim package
footprint, further enhancing power density and supporting more compact system designs.

"As power platforms continue evolving toward higher efficiency and greater power
density, advanced packaging technologies are becoming increasingly critical to overall
system performance," said Karl Chen, Senior Director of New Product Introduction
Center at USI. "By integrating SiC/GaN chip embedding, ceramic substrate insulation,
and wire-bondless architecture within industry-standard power packages, USI is enabling
a new generation of compact, efficient, and highly reliable power solutions – driving
the future of electric mobility, AI data center, and humanoid robotic."

USI stated that the combination of low stray inductance, minimal on-resistance, 
and superior thermal performance delivers a significant boost in energy conversion
efficiency and system reliability. This breakthrough supports the automotive and
industrial sectors in their transition toward higher-efficiency and next-generation
electrified platforms.

Beyond power modules, USI provides one-stop design-to-mass-production services for
automotive powertrain applications, including high-density 400V/800V inverter systems,
intelligent battery disconnect units (iBDU), and Xin1 integrated OBC/DCDC solutions.
Combining advanced engineering, PCBA, and box-build capabilities, USI delivers complete
solutions from development to high-volume manufacturing.

USI will exhibit at PCIM Europe 2026, taking place from June 9–11, 2026 in Nuremberg,
and will showcase its latest chip-embedded packaging technology, advanced power 
modules, and system integration solutions at Booth Hall 4-158. Visitors are invited
to meet with USI experts to explore how advanced packaging technologies enable higher
efficiency and greater reliability for applications in electric vehicles, AI data
centers, and humanoid robotics, as well as how USI’s one-stop design-to-mass-production
services accelerate product development and time-to-market.

**About USI** **(601231.SH)USI, Universal Scientific Industrial (Shanghai) Co., 
Ltd., is a global leader in electronic design and manufacturing as well as a leader
in the field of SiP (System-in-Package) technology. Our production and service locations
span four continents: Asia, Europe, the Americas, and Africa, offering customer 
diversified electronic products with D(MS)^(2) services: Design, Manufacturing, 
Miniaturization, Industrial software, and hardware Solutions, as well as material
procurement, logistics and maintenance Services. USI is a subsidiary of [ASE Technology Holding Co., Ltd.](https://www.aseglobal.com/)(
TWSE: 3711, NYSE: ASX). To learn more, please visit [www.usiglobal.com](http://www.usiglobal.com/)
and engage with us on [LinkedIn](https://www.linkedin.com/company/universal-scientific-industrial-co./?viewAsMember=true)
and [YouTube](https://www.youtube.com/channel/UC91ccQIfa_DPoVrbiP3_IJg).

 

---

  |  This article was produced by Cision PR Newswire, our trusted news partner. The views expressed and the content presented here are solely those of the author and may not fully reflect the opinions of Thailand Business News. |

---

 
**Read the original article :** [USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 ](http://www.prnasia.com/story/archive/4967415_AE67415_0?rand=184833)