# ZTE Expert David AN Shares TCO-Optimized AI Factory Vision at Data Centre World Singapore 2026

- Link: https://www.thailand-business-news.com/pr-news/zte-expert-david-an-shares-tco-optimized-ai-factory-vision-at-data-centre-world-singapore-2026
- Published: 2026-10-13T12:55:00+07:00
- Author: Media OutReach

SINGAPORE – [Media OutReach Newswire](https://www.media-outreach.com/) – 13 October
2026 – at Data Centre World (DCW) Singapore 2026, David AN, Director of ZTE CTO 
Group, delivered a keynote titled “From Data Center to AI Factory, TCO-Optimized
AIDC” in the DCW Keynote Theatre. The presentation outlined how the explosive growth
of AI is transforming data centers from traditional facilities into integrated AI
factories, and why the industry must optimize the entire AI factory lifecycle – 
not individual components—to achieve sustainable total cost of ownership (TCO).

 AN opened by highlighting the rapid acceleration of global computing demand. Inference
now drives 70% of intelligent computing growth, while global daily token usage has
increased by 1,000 times in just two years. By 2032, global data center scale is
projected to reach 246 GW, with AI data centers (AIDC) accounting for 52% of that
capacity. This surge is placing unprecedented pressure on power, cooling, architecture,
and deployment.

 “AI is pushing traditional data center architecture to its limits,” said David 
AN. “The industry must restructure power systems to dynamically match load demand,
reduce transmission loss, and rethink how compute, power, and cooling work together.”

 The presentation identified three industry trends:

 1. Power Becomes the New Bottleneck. Data center power is evolving from a single
grid input to multi-energy synergy and generation-storage-distribution-consumption
linkage. The system must match power with computing load in real time across day/
hour, hour, minute, second, and millisecond levels. Technologies such as 800V HVDC,
solid-state transformers (SST), and multi-level energy storage are essential.

 2. Cooling Must Follow Compute Density. Low-density data halls (≤40 kW) can rely
on air cooling with PUE ≤1.25. High-density halls (60–240 kW) require air-liquid
hybrid cooling with PUE ≤1.15. Ultra-high-density AI halls (≥600 kW) demand full
liquid cooling with PUE ≤1.09. Cooling must evolve alongside chip and rack trends
to support the next generation of AI workloads.

 3. AI Infrastructure Must Evolve at GPU Speed. Traditional site-assembled construction
is too slow. The industry is moving toward modularity and prefabrication, full-unit
transport, on-site assembly, and joint commissioning. With 90% MEP modularization,
delivery periods can be reduced by 50%. This approach also enables phased investment,
synchronized power and cooling matching, and sustained technology roadmap evolution.

 ZTE’s vision is to optimize the AI factory as one system that integrates the co-
design and coordination of computing, power, and cooling. This system is characterized
by synergy management, energy saving, flexible adaptability, and rapid delivery.
ZTE’s end-to-end AI infrastructure capabilities span power, cooling, and prefabricated
data centers. Key solutions include 800V HVDC power modules, safe lithium batteries,
intelligent busbars, cold-plate and immersion liquid cooling, fan walls, and fully
prefabricated data centers.

 With more than 20 countries, 500+ cases, 400,000 cabinets, more than 3,200MW, and
3.5 million square meters of delivered projects, ZTE has established itself as a
leading end-to-end data center solution provider. Since entering the modular data
center field in 2009, the company has continuously advanced prefabricated and green
data center technologies, solidifying its competitive position in the global data
center market.

Hashtag: #ZTE

[https://www.zte.com.cn](https://www.zte.com.cn)

The issuer is solely responsible for the content of this announcement.

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**Source** : [ZTE Expert David AN Shares TCO-Optimized AI Factory Vision at Data Centre World Singapore 2026](https://www.media-outreach.com/news/singapore/2026/10/13/493509/?rand=186006)

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